Title:
半導体装置の成膜方法
Document Type and Number:
Japanese Patent JP4099462
Kind Code:
B2
Inventors:
Masahiro Hiketa
Yasuhiro Uemoto
Yasuhiro Uemoto
Application Number:
JP2004156736A
Publication Date:
June 11, 2008
Filing Date:
May 26, 2004
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
C23C16/42; H01L21/316; H01L21/822; H01L27/04
Domestic Patent References:
| JP3166372A | ||||
| JP5259155A | ||||
| JP8008336A | ||||
| JP8306685A | ||||
| JP3198340A |
Attorney, Agent or Firm:
Hiromori Arai