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Title:
半導体装置
Document Type and Number:
Japanese Patent JP4124168
Kind Code:
B2
Inventors:
Noritaka Anzai
Application Number:
JP2004182031A
Publication Date:
July 23, 2008
Filing Date:
June 21, 2004
Export Citation:
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Assignee:
Oki Electric Industry Co., Ltd.
International Classes:
H01L21/3205; H01L23/52; H01L23/12
Domestic Patent References:
JP2001217349A
JP2001024084A
Attorney, Agent or Firm:
Takashi Ogaki



 
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