Title:
被処理体の処理方法及びその処理装置
Document Type and Number:
Japanese Patent JP4133333
Kind Code:
B2
Abstract:
The present invention is a processing method for applying predetermined processing to a workpiece with said workpiece mounted on a mounting stage arranged in a process chamber in a depressurized atmosphere, in which when no workpiece is mounted on the mounting stage, an inactive gas is discharged from at least a heat transfer gas supply hole of the mounting stage in the process chamber so that a gas layer is formed on a mounting surface of the mounting stage. The present invention is also a processing apparatus.
Inventors:
Hiroshi Nishikawa
Application Number:
JP2002564750A
Publication Date:
August 13, 2008
Filing Date:
February 15, 2002
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
H01L21/3065; C23F1/00; H01L21/00; H01L21/683; H05H1/24
Domestic Patent References:
| JP11330056A | ||||
| JP3048421A | ||||
| JP7249586A |
Attorney, Agent or Firm:
Takehiko Suzue
Sadao Muramatsu
Ryo Hashimoto
Satoshi Kono
Makoto Nakamura
Sadao Muramatsu
Ryo Hashimoto
Satoshi Kono
Makoto Nakamura