Title:
導電ペースト用銅合金粉
Document Type and Number:
Japanese Patent JP4146119
Kind Code:
B2
Abstract:
A copper alloy powder for an electrically conductive paste is provided, which is characterized in that the copper alloy powder comprises 80 to 99.9 mass % of Cu and 0.1 to 20 mass % of one or two elements selected from the group consisting of Ta and W and has an average particle size of 0.1 to 1 mu m. This copper alloy powder has a higher starting temperature for sintering, higher oxidation resistance and better heat resistance than a copper powder.
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Inventors:
Kennori Matsuki
Application Number:
JP2001370132A
Publication Date:
September 03, 2008
Filing Date:
December 04, 2001
Export Citation:
Assignee:
JFE Mineral Co., Ltd.
International Classes:
H01B1/02; B22F1/00; C22C1/04; C22C9/00; H01B1/00; H01B1/22; H01G4/008
Domestic Patent References:
| JP2194137A | ||||
| JP2001131655A |
Attorney, Agent or Firm:
Yoshio Kosugi
Masaki Yamada
Masaki Yamada
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