To provide a method by which an electronic component can be mounted on a wiring board with high electrical connection reliability without causing any undesirable electrical short circuit.

A bonding sheet for mounting on which conductive bonding films 5 and insulating bonding films 6 are formed is prepared on a carrier film, and the bonding films 5 and 6 are transferred to the surface of the electronic component 2 or wiring board 7 from the bonding sheet. Then the component 2 is mounted on the board 7 in a state where the bonding films 5 and 6 are arranged between the component 2 and the board 7, and the component 2 is mechanically joined to the board 7 with an electrical insulating resin constituting the insulating bonding films 6 in a state where the conductive bonding films 5 are separated from each other. At the same time, connection terminals 3 are electrically connected to conductive lands 8 through the conductive bonding films 5.

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