Title:
半導体発光素子及びその製造方法
Document Type and Number:
Japanese Patent JP4160597
Kind Code:
B2
Abstract:
A semiconductor light-emitting device comprises a multilayer structure and a glass substrate. The multilayer structure includes a plurality of laminated compound semiconductor layers and generates light. The multilayer structure has a light exit face for emitting the generated light, whereas the glass substrate optically transparent to the light is bonded to the light exit face by a film made of silicon oxide.
Inventors:
Akira Tanaka
Application Number:
JP2005516853A
Publication Date:
October 01, 2008
Filing Date:
December 27, 2004
Export Citation:
Assignee:
Hamamatsu Photonics Co., Ltd.
International Classes:
H01S5/183; H01S5/02; H01S5/042; H01S5/42; H01S5/026; H01S5/20; H01S5/30
Domestic Patent References:
| JP2002158373A | ||||
| JP7170027A | ||||
| JP2002368334A | ||||
| JP8255933A |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Shiro Terasaki
Satoru Ishida
Shiro Terasaki
Satoru Ishida