Title:
基板分断方法およびその方法を用いたパネル製造方法
Document Type and Number:
Japanese Patent JP4167227
Kind Code:
B2
Abstract:
Vertical cracks Vm in the thickness direction of a mother glass substrate 10 are sequentially formed along lines to be scribed and broken, and thus main scribe lines MS are formed along the lines to be scribed and broken of the mother glass substrate 10. Then, subordinate scribe lines SS are formed along the main scribe lines MS which have been formed, at a predetermined distance from the main scribe lines MS. Thus, the mother glass substrate 10 is broken along the main scribe lines MS. In this manner, the substrate can be scribed and broken efficiently without requiring a complicated device or the like.
Inventors:
Hitoshi Nishio
Application Number:
JP2004554984A
Publication Date:
October 15, 2008
Filing Date:
November 19, 2003
Export Citation:
Assignee:
Samsung Diamond Industry Co., Ltd.
International Classes:
B28D5/00; C03B33/023; C03B33/10; G02F1/13; G02F1/1333
Domestic Patent References:
| JP10330125A | ||||
| JP9188534A | ||||
| JP2003246637A |
Attorney, Agent or Firm:
Hidesaku Yamamoto
Takaaki Yasumura
Natsuki Morishita
Takaaki Yasumura
Natsuki Morishita