Title:
回路板用剥離性箔
Document Type and Number:
Japanese Patent JP4184407
Kind Code:
B2
Abstract:
In one embodiment, a peelable circuit board foil (200) has a metal support layer (205) and a conductive metal foil layer (210) bonded by an inorganic release material (215). The conductive metal foil layer has an exposed surface (212) that is coated with a high temperature anti-oxidant barrier (220) and has a roughness less than 0.05 microns RMS. In a second embodiment, the peelable printed circuit foil (200) has a crystallized dielectric oxide layer (405) disposed on the exposed surface of the conductive metal foil layer and an electrode layer (415) disposed on the crystallized dielectric oxide layer, forming a dielectric peelable circuit board foil (400) that may be adhered to a layer of a flexible or rigid circuit board, after which the metal support layer can be peeled away, leaving a capacitive structure including the metal foil layer, the crystallized dielectric oxide layer, and the electrode layer.
Inventors:
Dean, Timothy Bee.
Dan, Gregory Jay.
Cellini, Remy Jay.
Gamboa, Claudia buoy.
Dan, Gregory Jay.
Cellini, Remy Jay.
Gamboa, Claudia buoy.
Application Number:
JP2006534402A
Publication Date:
November 19, 2008
Filing Date:
October 08, 2004
Export Citation:
Assignee:
MOTOROLA INCORPORATED
International Classes:
H05K1/09; H05K1/16; H05K3/02; H05K3/46; H05K3/38
Domestic Patent References:
| JP2002009416A | ||||
| JP2003101179A | ||||
| JP2001301087A | ||||
| JP3073338A |
Attorney, Agent or Firm:
Mamoru Kuwagaki