プリント回路誘電箔及び埋設キャパシタ

Title:

プリント回路誘電箔及び埋設キャパシタ

Document Type and Number:

Japanese Patent JP4184409

Kind Code:

B2

Abstract:

A dielectric circuit board foil ( 400, 600 ) includes a conductive metal foil layer ( 210, 660 ), a crystallized dielectric oxide layer ( 405, 655 ) disposed adjacent a first surface of the conductive metal foil layer, a lanthanum nickelate layer ( 414, 664 ) disposed on the crystallized dielectric oxide layer, and an electrode layer ( 415, 665 ) that is substantially made of one or more base metals disposed on the lanthanum nickelate layer. The foil ( 400, 600 ) may be adhered to a printed circuit board sub-structure ( 700 ) and used to economically fabricate a plurality of embedded capacitors, including isolated capacitors of large capacitive density (>1000 pf/mm²).

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Inventors:

Dan, Gregory Jay.
Cellini, Remy Jay.
Croswell, Robert Tee.
Dean, Timothy Bee.
Gamboa, Claudia buoy.
Savic, Jobika

Application Number:

JP2006547176A

Publication Date:

November 19, 2008

Filing Date:

December 17, 2004

Export Citation:

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Assignee:

MOTOROLA INCORPORATED

International Classes:

H05K1/09; H05K1/16; H05K3/46; H05K3/02; H05K3/42

Foreign References:

US6819540

Attorney, Agent or Firm:

Mamoru Kuwagaki

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