Title:
真空成膜処理装置および方法
Document Type and Number:
Japanese Patent JP4187323
Kind Code:
B2
Abstract:
Disclosed is a vacuum film forming/processing apparatus and method which is hardly influenced by dusts and contamination on a substrate and moreover has a reduced exhaust volume. A substrate chamber for housing and holding a substrate and target chambers for housing and holding a target and an etching chamber are moved relatively. Any one of the target chambers, etching chamber and the substrate chamber are selectively coupled and communicated with each other, thereby creating a film forming chamber. In the film forming chamber, a film forming process to the substrate is performed and a multilayered film is formed. A conveying chamber which is conventionally provided is consequently made unnecessary. A problem of dusts and contamination occurring when the substrate passes through the conveying chamber is eliminated, so that the film quality and its stability are improved.
Inventors:
Takahiro Yamamoto
Application Number:
JP29090698A
Publication Date:
November 26, 2008
Filing Date:
October 13, 1998
Export Citation:
Assignee:
tdk Corporation
International Classes:
H01F41/14; H01L21/3065; C23C14/50; C23C14/56; C23F4/00; H01F41/30; H01L21/203; H01L21/302
Domestic Patent References:
| JP4285176A | ||||
| JP8325734A | ||||
| JP62050463A |
Attorney, Agent or Firm:
Yoichiro Fujishima
Yasushi Santanzaki
Yasushi Santanzaki