Title:
多層印刷回路基板およびその製造方法
Document Type and Number:
Japanese Patent JP4195056
Kind Code:
B2
Abstract:
A method for fabricating a double-sided or multi-layer printed circuit board (PCB) by ink jet printing that includes providing a substrate, forming a first self-assembly membrane (SAM) on at least one side of the substrate, forming a non-adhesive membrane on the first SAM, forming at least one microhole in the substrate, forming a second SAM on a surface of the microhole, providing catalyst particles on the at least one side of the substrate and on the surface of the microhole, and forming a catalyst circuit pattern on the substrate.
Inventors:
Min-Juan Yang
Chun-Way One
Cheer-chi-u
Chao-Kai Chen
Tsuzie-Jean Tseng
Chan-Min Lee
Chen-Po Yu
Chen-Hun Yu
Chun-Way One
Cheer-chi-u
Chao-Kai Chen
Tsuzie-Jean Tseng
Chan-Min Lee
Chen-Po Yu
Chen-Hun Yu
Application Number:
JP2006346159A
Publication Date:
December 10, 2008
Filing Date:
December 22, 2006
Export Citation:
Assignee:
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Unimicron Technology Corp.
Unimicron Technology Corp.
International Classes:
H05K3/42; H05K3/46; H05K3/18
Domestic Patent References:
| JP2002170936A | ||||
| JP2004140081A | ||||
| JP2005057140A | ||||
| JP2004342741A |
Attorney, Agent or Firm:
Takuji Yamada
Mitsuo Tanaka
Mikio Takeuchi
Mitsuo Tanaka
Mikio Takeuchi