Title:
金属ペーストを用いた半導体ウェハーへのバンプの形成方法
Document Type and Number:
Japanese Patent JP4255847
Kind Code:
B2
Abstract:
To provide a metal paste capable of forming a bump with small variations in hardness and as soft as possible within a range where necessary hardness is achieved.
The metal paste is composed of: at least one kind of metal powder having a purity of 99.9 wt.% or more, having a mean particle diameter of 0.005 to 1.0 μm, and selected from the group consisting of gold (Au) powder, silver (Ag) powder and palladium (Pd) powder; and an organic solvent. By using such a metal paste composed of a metal powder and an organic solvent alone without containing glass frit, it is possible to obtain a bump which exhibits an appropriate hardness when the bump is formed on a semiconductor wafer.
COPYRIGHT: (C)2005,JPO&NCIPI
Inventors:
Toshinori Ogashi
Masayuki Miyairi
Masayuki Miyairi
Application Number:
JP2004018102A
Publication Date:
April 15, 2009
Filing Date:
January 27, 2004
Export Citation:
Assignee:
Tanaka Kikinzoku Kogyo Co., Ltd.
International Classes:
H01B1/22; H01L21/60
Domestic Patent References:
| JP59146103A | ||||
| JP2003059958A | ||||
| JP2003141948A | ||||
| JP2003174055A | ||||
| JP2001167631A | ||||
| JP2001167633A | ||||
| JP10294018A | ||||
| JP6120229A | ||||
| JP5304368A |
Attorney, Agent or Firm:
Patent business corporation Tanaka, Okazaki and Associates
Daisuke Tanaka
Daisuke Tanaka