Title:
プラズマ処理装置、これに用いる誘電体板及び処理容器
Document Type and Number:
Japanese Patent JP4266610
Kind Code:
B2
Abstract:
Damage to a dielectric plate supporting unit and a metal vessel is kept to a minimum and the efficiency of plasma processing is improved. A resin layer is provided in a region where a dielectric plate and a processing vessel face each other. With this structure, particles and damage attributed to the difference of thermal expansion coefficients between the dielectric plate and the process vessel can be suppressed. In addition, local discharges at electric field boundaries such as edge portions of the dielectric plate are suppressed, thereby improving the efficiency of plasma processing such as formation of an oxide film.
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Inventors:
Osamu Morita
Application Number:
JP2002297689A
Publication Date:
May 20, 2009
Filing Date:
October 10, 2002
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
H01L21/31; H05H1/46; B01J19/08; H01J37/32; H01L21/00
Domestic Patent References:
| JP8106993A | ||||
| JP696895A | ||||
| JP6467908A | ||||
| JP2002270599A | ||||
| JP2000299198A | ||||
| JP3120382A | ||||
| JP10189547A | ||||
| JP1140549A | ||||
| JP2000106298A |
Attorney, Agent or Firm:
Yuji Iizuka