Title:
非導電性基板表面、特にポリイミド表面に直接金属層を形成する方法
Document Type and Number:
Japanese Patent JP4291353
Kind Code:
B2
Abstract:
A non-conductive substrate surface is etched with an acidic etchant solution containing peroxide (I). The etched substrate surface is contacted with acidic treatment solution containing permanganate. The treated substrate surface is activated using an acidic activator solution comprising peroxide (II). The activated substrate surface is contacted with an acidic catalytic solution containing thiophene derivative and sulfonic acid derivative. The treated substrate surface is metallized in an acidic electrolytic metallization bath. The non-conductive substrate surface is polyimide surface. The etchant solution and the activator solution further contain sulfuric acid, methane sulfonic acid, methane disulfonic acid, phenolsulfuric acid and/or phosphoric acid. The acidic treatment solution further contains hydrochloric acid, sulfuric acid, phosphoric acid, methane sulfonic acid and/or methane disulfonic acid. The acidic catalytic solution comprises 3,4-alkylenedioxythiophene and styrene sulfonic acid. The acidic electrolytic metallization bath is copper-containing metallization bath.
Inventors:
Wolter Kronenberg
Jürgen Houpe
Jürgen Houpe
Application Number:
JP2006303468A
Publication Date:
July 08, 2009
Filing Date:
November 09, 2006
Export Citation:
Assignee:
Enthone Inc.
International Classes:
C25D5/56
Domestic Patent References:
| JP2002515657A | ||||
| JP5506125A | ||||
| JP8213753A | ||||
| JP11012786A | ||||
| JP11509985A |
Attorney, Agent or Firm:
Toshio Yano
Toshiomi Yamazaki
Takuya Kuno
Hiroshi Sugimoto
Kimihiro Hoshi
Hiroyasu Ninomiya
Einzel Felix-Reinhard
Takaho Kawawa
Toshiomi Yamazaki
Takuya Kuno
Hiroshi Sugimoto
Kimihiro Hoshi
Hiroyasu Ninomiya
Einzel Felix-Reinhard
Takaho Kawawa