Title:
半導体装置
Document Type and Number:
Japanese Patent JP4300371
Kind Code:
B2
Abstract:
A semiconductor device according to a preferred embodiment of the present invention is a semiconductor device including a main substrate and one or more sub substrates, and the semiconductor device includes first heat generating devices mounted on the sub substrates, sub-substrate heatsinks mounted to the first heat generating devices, and a main-substrate heatsink mounted to the main substrate, wherein the sub-substrate heatsinks and the main-substrate heatsink are secured to each other, such that there is a predetermined positional relationship between the sub substrates and the main substrate.
Inventors:
Atsushi Minagawa
Sekiya Mamoru
Norio Umezu
Sekiya Mamoru
Norio Umezu
Application Number:
JP2007295203A
Publication Date:
July 22, 2009
Filing Date:
November 14, 2007
Export Citation:
Assignee:
Onkyo Co., Ltd.
International Classes:
H05K7/20; H01L23/36
Domestic Patent References:
| JP9139592A | ||||
| JP2005166907A | ||||
| JP2004172468A | ||||
| JP63046899U |
Attorney, Agent or Firm:
Minoru Yoshida
Tatsuya Tanaka
Tsukasa Senba
Hiroshi Furusawa
Tatsuya Tanaka
Tsukasa Senba
Hiroshi Furusawa