Title:
電子機器の放熱装置
Document Type and Number:
Japanese Patent JP4300706
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a heat radiator of electronic equipment, capable of efficiently radiating the heat of heating components mounted on a wiring board to the outside. SOLUTION: In this heat radiator of electronic equipment provided with a wiring board 16, on which electronic components 19 and 20 are mounted and a case 17 mounted on the wiring board 16 for electromagnetic shielding, a heat transfer plate part 13 is formed through elastic bending parts 14a and 14b as a spring mechanism part, in parallel with the wiring board 16 in a metallic frame body 12 to be fit into the case 17 so as to be detachable, and an abutting face part 13a of the heat transfer plate part 13 is set to abut against the heating component 20, and a heat-radiating face part 13b is formed continuously on the abutting face part 13a.
Inventors:
Masashi Imai
Goro Matsuura
Goro Matsuura
Application Number:
JP2000389027A
Publication Date:
July 22, 2009
Filing Date:
December 21, 2000
Export Citation:
Assignee:
ソニー株式会社
International Classes:
H05K7/20; H05K9/00; H01L23/40
Domestic Patent References:
| JP59166488U | ||||
| JP4296098A | ||||
| JP3255697A | ||||
| JP2138797A | ||||
| JP10284650A | ||||
| JP7030280A | ||||
| JP61059396U | ||||
| JP8279689A |
Attorney, Agent or Firm:
Yoshitsuno Kakuda
Hironobu Isoyama
Hidemori Matsukuma
Hironobu Isoyama
Hidemori Matsukuma