Title:
真空スパッタ装置
Document Type and Number:
Japanese Patent JP4306958
Kind Code:
B2
Abstract:
PCT No. PCT/GB98/02642 Sec. 371 Date Jan. 5, 2000 Sec. 102(e) Date Jan. 5, 2000 PCT Filed Sep. 3, 1998 PCT Pub. No. WO99/13491 PCT Pub. Date Mar. 18, 1999A vacuum sputtering apparatus (1) is described in which a target (7) having a target face (8) is mounted in a vacuum chamber (2) opposite a substrate (15). A magnetic pole plate (16) having a non-magnetic carrier plate (17) attached thereto is mounted behind the target (7) on a shaft (28) and can be rotated by means of a motor (29) about an axis substantially orthogonal to the target face (8). Carrier plate (17) has an array of holes (19) each of which can receive a corresponding first bar magnet (20, 21). There are fewer magnets (20, 21) than there are holes (19) and the magnets (20, 21) are removable from their holes (19). Carrier plate (17) also has a circumferential line of holes (22), in each of which may be mounted a corresponding second bar magnet (23). By varying the number and positions of the bar magnets (20, 21, 23) in the holes (19, 22) a variety of different high density plasma zone shapes (24; 25, 26; 27; 28) can be produced upon the target face (8). Conveniently, the bar magnets (20, 21, 23) are round in section but can alternatively be of square or hexagonal section, if desired.
Inventors:
Pearson, David, Ian Charles
Application Number:
JP2000511181A
Publication Date:
August 05, 2009
Filing Date:
September 03, 1998
Export Citation:
Assignee:
Nordico limited
International Classes:
C23C14/35; H01J37/34
Domestic Patent References:
| JP10121236A | ||||
| JP7090578A | ||||
| JP5009721A |
Attorney, Agent or Firm:
Satoshi Furuya
Kaoru Furuya
Takahiko Mizobe
Kaoru Furuya
Takahiko Mizobe