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Title:
半導体基板の乾燥装置および半導体基板の乾燥方法
Document Type and Number:
Japanese Patent JP4311809
Kind Code:
B2
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Inventors:
Kazumi Asada
Iwamoto Hayato
Teruomi Minami
Application Number:
JP10843699A
Publication Date:
August 12, 2009
Filing Date:
April 15, 1999
Export Citation:
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Assignee:
ソニー株式会社
東京エレクトロン株式会社
International Classes:
H01L21/304; F26B21/14
Domestic Patent References:
JP6181198A
JP6275596A
JP9069509A
JP63182818A
Attorney, Agent or Firm:
Koichi Mori



 
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