Title:
構造体
Document Type and Number:
Japanese Patent JP4320380
Kind Code:
B2
More Like This:
Inventors:
Takafumi 800
Cho Akira
Cho Akira
Application Number:
JP2006272321A
Publication Date:
August 26, 2009
Filing Date:
October 03, 2006
Export Citation:
Assignee:
Tohoku Techno Arch Co., Ltd.
Furukawa Metal Co., Ltd.
Mitsubishi Chemical Corporation
dowa Electronics Co., Ltd.
Epivalley Company Limited
Wave Square, Incorporated
Furukawa Metal Co., Ltd.
Mitsubishi Chemical Corporation
dowa Electronics Co., Ltd.
Epivalley Company Limited
Wave Square, Incorporated
International Classes:
C30B29/38; H01L21/205
Domestic Patent References:
JP2005119921A | ||||
JP2007116097A |
Attorney, Agent or Firm:
Yasunori Otsuka
Shiro Takayanagi
Yasuhiro Otsuka
Shuji Kimura
Shiro Takayanagi
Yasuhiro Otsuka
Shuji Kimura