Title:
レーザ加工装置およびレーザ加工方法
Document Type and Number:
Japanese Patent JP4333172
Kind Code:
B2
Inventors:
Hirokazu Kato
Satoshi Hinata
Hide Toyama
Satoshi Hinata
Hide Toyama
Application Number:
JP2003078303A
Publication Date:
September 16, 2009
Filing Date:
March 20, 2003
Export Citation:
Assignee:
Mitsubishi Materials Corporation
Kamaya Electric Co., Ltd.
Kamaya Electric Co., Ltd.
International Classes:
B23K26/073; B23K26/06; B23K26/10; B23K101/36
Domestic Patent References:
| JP2003033892A | ||||
| JP10314972A | ||||
| JP2000340872A | ||||
| JP2001111078A | ||||
| JP2000326085A | ||||
| JP2002246677A |
Attorney, Agent or Firm:
Chiharu Shimizu