Title:
ワイヤボンディング方法
Document Type and Number:
Japanese Patent JP4361593
Kind Code:
B1
Abstract:
Wire bonding method for reducing height of a wire loop in a semiconductor device, including a first bonding step of bonding an initial ball formed at a tip end of a wire onto a first bonding point using a capillary, thereby forming a pressure-bonded ball; a wire pushing step of pushing the wire obliquely downward toward the second bonding point at a plurality of positions by repeating a sequential movement for a plurality of times, the sequential movement including moving of the capillary substantially vertically upward and then obliquely downward toward the second bonding point by a distance shorter than a rising distance that the capillary has moved upward; and a second bonding step of moving the capillary upward and then toward the second bonding point, and bonding the wire onto the second bonding point by pressure-bonding.
Inventors:
Ritsunari Mitsui
Chung Morisuke
Kiuchi Hitoto
Chung Morisuke
Kiuchi Hitoto
Application Number:
JP2008270913A
Publication Date:
November 11, 2009
Filing Date:
October 21, 2008
Export Citation:
Assignee:
Shinkawa Co., Ltd.
International Classes:
H01L21/60
Domestic Patent References:
| JP200049185A | ||||
| JP10189641A | ||||
| JP2000114304A | ||||
| JP2006270096A | ||||
| JP2008235787A |
Attorney, Agent or Firm:
Kenji Yoshida
Jun Ishida
Jun Ishida