Title:
化学機械研磨方法
Document Type and Number:
Japanese Patent JP4366627
Kind Code:
B2
Inventors:
Hiroshi Oishi
Application Number:
JP2002313213A
Publication Date:
November 18, 2009
Filing Date:
October 28, 2002
Export Citation:
Assignee:
Shin-Etsu Semiconductor Co., Ltd.
International Classes:
B24B57/02; B24B37/00; C09K3/14; H01L21/304
Domestic Patent References:
| JP7235519A | ||||
| JP8022970A | ||||
| JP2000315665A |
Attorney, Agent or Firm:
Masanori Sugawara