Title:
LSIパッケージの実装方法
Document Type and Number:
Japanese Patent JP4394213
Kind Code:
B2
Inventors:
Jun Saito
Tomoyuki Hiramatsu
Ogiso Honor
Tomoyuki Hiramatsu
Ogiso Honor
Application Number:
JP27210499A
Publication Date:
January 06, 2010
Filing Date:
September 27, 1999
Export Citation:
Assignee:
株式会社デンソー
International Classes:
H01L21/60; H01L21/56
Domestic Patent References:
| JP11204568A | ||||
| JP10112476A | ||||
| JP10199937A | ||||
| JP10144707A | ||||
| JP661304A | ||||
| JP11204556A | ||||
| JP4345041A | ||||
| JP312942A | ||||
| JP689914A | ||||
| JP1140711A | ||||
| JP917911A | ||||
| JP5283455A | ||||
| JP11214440A | ||||
| JP11186455A | ||||
| JP11243162A |
Attorney, Agent or Firm:
Takashi Ito
Takanori Kubo
Akira Nagai
Hirohiko Usui
Takanori Kubo
Akira Nagai
Hirohiko Usui