Title:
半導体封止用エポキシ樹脂組成物及び半導体装置
Document Type and Number:
Japanese Patent JP4400121
Kind Code:
B2
Inventors:
Keiichi Sakudo
Application Number:
JP2003200933A
Publication Date:
January 20, 2010
Filing Date:
July 24, 2003
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
C08L63/00; C08G59/62; C08K7/24; H01L23/29; H01L23/31
Domestic Patent References:
| JP2001354754A | ||||
| JP10298407A | ||||
| JP5009270A | ||||
| JP5206325A |