Title:
電子機器の空冷装置
Document Type and Number:
Japanese Patent JP4420230
Kind Code:
B2
Abstract:
A device for air-cooling an electronic apparatus, where a suction opening (4) is provided in a housing (1), discharge openings (5) are provided in housings (1, 2), an airflow passing the inside of the housings is generated by a fan (6), and heat produced by a heart-producing body (9) is released to the outside of the housings by the airflow. Air introduction plates (7a) inclined to change the direction of the airflow are arranged at the suction opening (4), and a large number of projections (7b) are formed on the surfaces of the air introduction plates. The device for air-cooling an electronic apparatus has increased capacity for cooling a heat-producing part without increase in the size of the device, and in the device, accumulation of dust on the heat-producing part can be prevented.
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Inventors:
Sanzen Toyawa
Application Number:
JP2005150496A
Publication Date:
February 24, 2010
Filing Date:
May 24, 2005
Export Citation:
Assignee:
Kenwood Corporation
International Classes:
H05K7/20
Domestic Patent References:
| JP6152170A | ||||
| JP8071347A | ||||
| JP60156808U | ||||
| JP2003324298A | ||||
| JP7055312A | ||||
| JP60005415U |
Attorney, Agent or Firm:
Masao Shibata