Title:
ウエーハの分割方法および分割装置
Document Type and Number:
Japanese Patent JP4447392
Kind Code:
B2
Abstract:
A method of dividing a wafer whose strength is reduced along a plurality of dividing lines formed on the front surface in a lattice pattern, along the dividing lines, comprising: a tape affixing step for affixing a protective tape to one surface side of the wafer; a holding step for positioning a first suction-holding member and a second suction-holding member on both sides of a dividing line and suction-holding the wafer on the first suction-holding member and the second suction-holding member through the protective tape; and a dividing step for moving the first suction-holding member and the second suction-holding member in a direction for separating them from each other to exert tensile force in a direction perpendicular to the dividing line.
Inventors:
Naoki Omiya
Yusuke Nagai
Masaru Nakamura
Yusuke Nagai
Masaru Nakamura
Application Number:
JP2004215111A
Publication Date:
April 07, 2010
Filing Date:
July 23, 2004
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
H01L21/301
Domestic Patent References:
| JP59117235A | ||||
| JP2001102329A | ||||
| JP2002334852A |
Foreign References:
| WO2003002471A1 |
Attorney, Agent or Firm:
Naozumi Ono
Sachiko Okunuki
Sachiko Okunuki