Title:
電子部品搭載用基板
Document Type and Number:
Japanese Patent JP4454165
Kind Code:
B2
Inventors:
Ryuji Takato
Application Number:
JP2001022249A
Publication Date:
April 21, 2010
Filing Date:
January 30, 2001
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H01L23/02; H01L23/12
Domestic Patent References:
| JP62195152A |