Title:
封止材タブレット
Document Type and Number:
Japanese Patent JP4470962
Kind Code:
B2
Abstract:
To provide a method of producing an encapsulating molding material tablet by which adhesion of an encapsulating molding material to the punch surface of a tablet forming machine can be reduced, an encapsulating molding material tablet produced by this method, and an electronic part apparatus equipped with an element encapsulated using this encapsulating molding material tablet. A method of producing an encapsulating molding material tablet in which a release agent dissolved in a solvent is fed to the punch surface of a tablet forming machine to form a release agent layer having a thickness of over 0.001 mum and less than 0.07 mum on the above-mentioned punch surface, then, an encapsulating molding material is fed to the above-mentioned tablet forming machine for molding the material, an encapsulating molding material tablet produced by this method or having a contact angle ratio of 1.15 or more and less than 1.35, and an electron part apparatus equipped with an element encapsulated using this encapsulating molding material tablet.
Inventors:
Kubo Katsumi
Inagawa Setsu
Hiroshi Terada
Akio Ono
Hiroshi Masubuchi
Takeo Yamada
Inagawa Setsu
Hiroshi Terada
Akio Ono
Hiroshi Masubuchi
Takeo Yamada
Application Number:
JP2007142253A
Publication Date:
June 02, 2010
Filing Date:
May 29, 2007
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
H01L21/56; B29B11/12; B29C33/58; B29C33/64; H01L23/29; H01L23/31; H01L21/00
Domestic Patent References:
| JP7117048A | ||||
| JP9193149A | ||||
| JP11335445A | ||||
| JP9057749A | ||||
| JP8323745A | ||||
| JP2001233937A |
Attorney, Agent or Firm:
Hidekazu Miyoshi
Iwa Saki Kokuni
Kawamata Sumio
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu
Iwa Saki Kokuni
Kawamata Sumio
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu