Title:
スクライブ方法およびこれに基づくスクライブ装置
Document Type and Number:
Japanese Patent JP4472112
Kind Code:
B2
Abstract:
To solve the problem that when a cutter wheel tip runs on a glass plate in scribing by outer cut, chipping is generated at an edge of the glass plate or direction of a chip holder is changed and consequently scribe line cannot be scribed near end face of the glass plate. Another scribing data obtained by reducing scribing speed, scribing load and depth of cut set as scribing data at the time of actually scribing the glass plate by the cutter wheel tip, are adopted as data at the time of running of the cutter wheel tip on the glass plate.
Inventors:
Hiroki Ueyama
Application Number:
JP2000137023A
Publication Date:
June 02, 2010
Filing Date:
May 10, 2000
Export Citation:
Assignee:
Samsung Diamond Industry Co., Ltd.
International Classes:
C03B33/037; C03B33/027
Domestic Patent References:
| JP7126027A | ||||
| JP10338534A | ||||
| JP6345471A | ||||
| JP56092133A | ||||
| JP2000119030A | ||||
| JP2000086262A |
Attorney, Agent or Firm:
Takuji Yamada
Mitsuo Tanaka
Aoyama Aoi
Mitsuo Tanaka
Aoyama Aoi