Title:
多層基板の製造方法、多層基板および回路装置
Document Type and Number:
Japanese Patent JP4502697
Kind Code:
B2
Inventors:
Takeshi Nakamura
Katsumi Ito
Katsumi Ito
Application Number:
JP2004125995A
Publication Date:
July 14, 2010
Filing Date:
April 21, 2004
Export Citation:
Assignee:
Sanyo Electric Co., Ltd.
International Classes:
H05K3/00; H05K3/46
Domestic Patent References:
| JP10270848A | ||||
| JP2000188483A | ||||
| JP2003060356A | ||||
| JP7162158A | ||||
| JP11177242A | ||||
| JP2002033584A |
Attorney, Agent or Firm:
Takashi Okada