Title:
埋込接続を備えた微小集積構造、特に、ハードディスクドライブユニット用の集積マイクロアクチュエータを製造する方法
Document Type and Number:
Japanese Patent JP4542226
Kind Code:
B2
Abstract:
The method is intended for manufacturing a microintegrated structure (10), typically a microactuator for a hard-disk drive unit and includes the steps of: forming interconnection regions (32a,32b) in a substrate (31) of semiconductor material; forming a first monocrystalline epitaxial layer (33); forming lower sinker regions (35a,35b) in the monocrystalline epitaxial layer (33) and in direct contact with the interconnection regions (32a,32b); forming insulating material regions (40,41) on a structure portion of the monocrystalline epitaxial layer (33); growing a second layer (45) formed by a polycrystalline portion (45') above the insulating material region and elsewhere a monocrystalline portion (45''), and forming upper sinker regions (46,47) in the second layer (45) and in direct contact with the lower sinker regions (35a). In this way no PN junctions are present inside the polycrystalline portion (45') of the second layer and the structure has a high breakdown voltage.
Inventors:
Benedetto Vigna
Paolo Ferrari
Paolo Ferrari
Application Number:
JP2000123335A
Publication Date:
September 08, 2010
Filing Date:
March 22, 2000
Export Citation:
Assignee:
STMicroelectronics S.r.l.
International Classes:
B81C1/00; B81B3/00; G11B5/55; G11B5/596; G11B21/10; G11B21/21; H02N1/00
Domestic Patent References:
| JP10163168A | ||||
| JP10132846A | ||||
| JP8228016A | ||||
| JP11325916A | ||||
| JP2000024964A |
Attorney, Agent or Firm:
Yamato Tsutsui
Yoshitaka Kozuka
Ning Takano
Yoshitaka Kozuka
Ning Takano