ウェハ表面に近接して保持される複数の入口及び出口を使用して半導体ウェハ表面を乾燥させる方法及び装置

Title:

ウェハ表面に近接して保持される複数の入口及び出口を使用して半導体ウェハ表面を乾燥させる方法及び装置

Document Type and Number:

Japanese Patent JP4559226

Kind Code:

B2

Abstract:

One of many embodiments of a substrate preparation system is provided which includes a head having a head surface where the head surface is proximate to a surface of the substrate. The system also includes a first conduit for delivering a first fluid to the surface of the substrate through the head, and a second conduit for delivering a second fluid to the surface of the substrate through the head, where the second fluid is different than the first fluid. The system also includes a third conduit for removing each of the first fluid and the second fluid from the surface of the substrate where the first conduit, the second conduit and the third conduit act substantially simultaneously. In an alternative embodiment, a method for processing a substrate is provided that includes generating a fluid meniscus on a surface of the substrate and applying acoustic energy to the fluid meniscus. The method also includes moving the fluid meniscus over the surface the substrate to process the surface of the substrate.

Inventors:

Delarios John M.
Garcia James P.
Woods Curl
Lovekin Mike
Redeker Fritz
Boyd John
Nikko Afshin

Application Number:

JP2004540334A

Publication Date:

October 06, 2010

Filing Date:

September 30, 2003

Export Citation:

Click for automatic bibliography generation Help