Title:
樹脂材料に液状添加物を分散させて射出する射出装置
Document Type and Number:
Japanese Patent JP4564784
Kind Code:
B2
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Inventors:
Shuji Aiba
Application Number:
JP2004165721A
Publication Date:
October 20, 2010
Filing Date:
June 03, 2004
Export Citation:
Assignee:
Sodick Plus Tech Co., Ltd.
International Classes:
B29C45/54; B29C45/48; B29C45/76
Domestic Patent References:
| JP54070367A | ||||
| JP5050487A | ||||
| JP4286617A | ||||
| JP2004025465A | ||||
| JP57008128A |