Title:
電子部品内蔵基板の製造方法
Document Type and Number:
Japanese Patent JP4575071
Kind Code:
B2
Abstract:
An electronic component embedded substrate and a method for manufacturing the substrate are disclosed. The electronic component embedded substrate includes a substrate main body and an electronic component embedded in the substrate main body. The center plane of the electronic component in the thickness direction thereof and the center plane of the substrate main body in the thickness direction thereof generally match each other.
Inventors:
Masahiro Sunohara
Mitsutoshi Toko
Kei Murayama
Hiroyuki Kato
Mitsutoshi Toko
Kei Murayama
Hiroyuki Kato
Application Number:
JP2004225543A
Publication Date:
November 04, 2010
Filing Date:
August 02, 2004
Export Citation:
Assignee:
Shinko Electric Industry Co., Ltd.
International Classes:
H05K3/46
Domestic Patent References:
| JP11102985A | ||||
| JP200177483A | ||||
| JP2003298236A | ||||
| JP2002271032A | ||||
| JP2001217337A |
Attorney, Agent or Firm:
Tadahiko Ito