Title:
接着材リール
Document Type and Number:
Japanese Patent JP4596086
Kind Code:
B2
Abstract:
The bonding-material reel according to the present invention includes a tape for circuit connection having a tape-shaped base material and an adhesive layer formed on one surface of the base material, and a core around which the tape for circuit connection is wound, wherein the tape for circuit connection has an end tape which has been bonded to the terminal end, a region in which the adhesive layer is not formed over at least one reel length of the core toward the start end of the tape for circuit connection from the terminal end thereof, and a cover tape which is provided so as to cover the region.
Inventors:
Takashi Tachizawa
Takashi Seki
Koji Kobayashi
Mitsugu Fujinawa
Yasuhiro Arifu
Kotaro Seki
Takashi Seki
Koji Kobayashi
Mitsugu Fujinawa
Yasuhiro Arifu
Kotaro Seki
Application Number:
JP2010039154A
Publication Date:
December 08, 2010
Filing Date:
February 24, 2010
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
H01R11/01; B65H75/28; C09J7/22; C09J7/38; H01B5/16; H05K1/14; H05K3/32
Domestic Patent References:
| JP2001284005A | ||||
| JP2005336447A | ||||
| JP200615621A |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Yoshinori Shimizu