Title:
剥離方法および半導体装置の作製方法
Document Type and Number:
Japanese Patent JP4602261
Kind Code:
B2
Inventors:
Toru Takayama
Junya Maruyama
Shunpei Yamazaki
Junya Maruyama
Shunpei Yamazaki
Application Number:
JP2006036668A
Publication Date:
December 22, 2010
Filing Date:
February 14, 2006
Export Citation:
Assignee:
Semiconductor Energy Laboratory Co., Ltd.
International Classes:
H01L21/02; H01L21/20; H01L21/268; H01L21/336; H01L27/12; H01L29/786
Domestic Patent References:
| JP2003163337A | ||||
| JP10125929A | ||||
| JP10125930A | ||||
| JP10125931A | ||||
| JP7142570A | ||||
| JP11087799A | ||||
| JP11135882A | ||||
| JP2001166301A | ||||
| JP2001189460A |
Foreign References:
| WO1998021750A1 |