Title:
電気電子部品用銅合金材およびその製造方法
Document Type and Number:
Japanese Patent JP4615616
Kind Code:
B2
Abstract:
An copper alloy material for electric/electronic components containing Co by 0.2 to 2 mass% and Si by 0.05 to 0.5 mass% and having a remaining component composed of Cu and unavoidable impurities, characterized in that its grain size is 3 to 35 µm and size of precipitate containing the both of Co and Si is 5 to 50 nm, electric conductivity is 50 % IACS or more, tensile strength is 500 MPa or more and bending workability (R/t) is 2 or less.
Inventors:
Kuniteru Mihara
Ryosuke Matsuo
Tachihiko Eguchi
Ryosuke Matsuo
Tachihiko Eguchi
Application Number:
JP2009551614A
Publication Date:
January 19, 2011
Filing Date:
January 30, 2009
Export Citation:
Assignee:
THE FURUKAW ELECTRIC CO.,LTD.
International Classes:
C22C9/06; C22C9/02; C22C9/04; C22C9/05; C22C9/10; C22F1/08; H01B1/02; C22F1/00
Domestic Patent References:
| JP2007169765A | 2007-07-05 |
Attorney, Agent or Firm:
Toshizo Iida
Naosuke Miyamae
Naosuke Miyamae