To provide a system and a method for inspecting circuit boards and capable of satisfactorily absorbing variations in the height of electrodes to be inspected of circuit boards to be inspected and securing insulation between adjacent inspection electrodes even if the electrodes to be inspected have fine pitches.
When a circuit board 1 to be inspected is further pressed between a first inspection jig 11a and a second inspection jig 11b, local stress concentration is avoided by dispersing pressure concentration to variations in the height of electrodes to be inspected of the circuit board 1 to be inspected (variations in the height of solder-ball electrodes) by the spring elasticity of a first insulating plate 34, a second insulating plate 35, and an intermediate holding plate 36 arranged between the first insulating plate 34 and the second insulating plate 35 in a relay pin unit 31 in addition to the rubber elastic compression of an first anisotropic electrically conductive sheet 71, a second anisotropic electrically conductive sheet 73, a third anisotropic electrically conductive sheet 75, a fourth anisotropic electrically conductive sheet 77, and a fifth anisotropic electrically conductive sheet 42. The intermediate holding plate 36 is bent in the direction of the second insulating plate 35 and bent in the direction of the first insulating plate 34.
COPYRIGHT: (C)2007,JPO&INPIT
Sugio Shimoda
Fujio Hara
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Chihata Takahata
Toru Suzuki