Title:
基板熱処理装置
Document Type and Number:
Japanese Patent JP4666496
Kind Code:
B2
Abstract:
A substrate heat treatment apparatus includes a heat-treating plate having a flat upper surface, support devices formed of a heat-resistant resin for contacting and supporting a substrate, a seal device disposed annularly for rendering gastight a space formed between the substrate and heat-treating plate, and exhaust bores for exhausting gas from the space. The support devices are formed of resin, and the upper surface of the heat-treating plate is made flat, whereby a reduced difference in the rate of heat transfer occurs between contact parts and non-contact parts on the surface of the substrate. Consequently, the substrate is heat-treated effectively while suppressing variations in heat history over the surface of the substrate.
Inventors:
Shigehiro Goto
Keiji Matsuchika
Akihiko Morita
Keiji Matsuchika
Akihiko Morita
Application Number:
JP2005353432A
Publication Date:
April 06, 2011
Filing Date:
December 07, 2005
Export Citation:
Assignee:
Dainippon Screen Mfg. Co., Ltd.
International Classes:
H01L21/027; H01L21/683
Domestic Patent References:
| JP10284360A | ||||
| JP2003022947A | ||||
| JP8279548A | ||||
| JP2004288717A |
Attorney, Agent or Firm:
Tsutomu Sugiya