Title:
LEDパッケージフレーム並びにこれを採用するLEDパッケージ
Document Type and Number:
Japanese Patent JP4674158
Kind Code:
B2
Abstract:
An LED package frame includes an LED chip and a heat conductive member made of high heat conductivity material. The heat conductive member has a receiving part at a lateral portion, and is mounted with the LED chip. A lead-coating assembly configured to be inserted into the receiving part of the heat conductive member, including a lead is inserted at one end into the receiving part of the heat conductive member, and electrically connected to the LED chip. An electrically insulating layer is placed in tight contact between the lead and the receiving part of the heat conductive member isolates the lead from the receiving part. With the lead inserted into the heat conductive member, it is possible to reduce size while maintaining high heat conductivity and stability.
Inventors:
Park Young Sam
Region iku
Hanfun Ju
Kim hyun saku
Kim Bang Jin
John Yong Jun
Unhosik
Park Jun Kyu
Region iku
Hanfun Ju
Kim hyun saku
Kim Bang Jin
John Yong Jun
Unhosik
Park Jun Kyu
Application Number:
JP2005376056A
Publication Date:
April 20, 2011
Filing Date:
December 27, 2005
Export Citation:
Assignee:
Rensselaer Polytechnic Institute
International Classes:
H01L33/60; H01L33/62
Domestic Patent References:
| JP2004071771A | ||||
| JP2003347588A | ||||
| JP2005019662A |
Attorney, Agent or Firm:
Longhua International Patent Service Corporation