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Title:
基板処理装置および半導体装置の製造方法
Document Type and Number:
Japanese Patent JP4679369
Kind Code:
B2
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Inventors:
Kenji Shinozaki
Application Number:
JP2005516973A
Publication Date:
April 27, 2011
Filing Date:
December 08, 2004
Export Citation:
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Assignee:
Hitachi Kokusai Electric Co., Ltd.
International Classes:
H01L21/31; C23C16/44; H01L21/00; H01L21/26; H01L21/3065; C23C16/46
Domestic Patent References:
JPH1012517A1998-01-16
JPH05121342A1993-05-18
JP2000114196A2000-04-21
JP2000133600A2000-05-12
JPH10270372A1998-10-09
JPH10242066A1998-09-11
JP2002246326A2002-08-30
JPH05326530A1993-12-10
JPS61285713A1986-12-16
JP2003037108A2003-02-07
JPH04652U1992-01-07
Attorney, Agent or Firm:
Kajiwara Tatsuya



 
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