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Title:
半導体試験装置及び方法並びに半導体試験シミュレーション装置
Document Type and Number:
Japanese Patent JP4682956
Kind Code:
B2
Abstract:

To provide a semiconductor test device and method and a simulation device for semiconductor test capable of easily performing cause investigation at low cost when in fail by enabling various timings to be set to negative values without a large increase of costs.

A timing setting value calculation part 22 calculates setting values of various timing based on a test program P10 with which at least one of rise-up and fall timings of test signals T1-Tn and quality determination timing of a signal acquired from a semiconductor device 30 is specified. An adding part 23 adds offset quantity specified in the test program P10 for a set value determined in the timing setting value calculation part 22. The setting value to which the offset quantity is added is set in a register 16, and a signal generation device 11 generates the test signals T1-Tn and a strobe signal ST at the timing according to the set content of the register 16.

COPYRIGHT: (C)2008,JPO&INPIT


Inventors:
Sadaki Anzai
Application Number:
JP2006236594A
Publication Date:
May 11, 2011
Filing Date:
August 31, 2006
Export Citation:
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Assignee:
Yokogawa Electric Corporation
International Classes:
G01R31/28; G01R31/3183
Domestic Patent References:
JP4102083A
JP8146099A
JP1282481A
JP2001255357A
Attorney, Agent or Firm:
Masatake Shiga
Tadashi Takahashi
Takashi Watanabe
Masakazu Aoyama
Suzuki Mitsuyoshi
Kazuya Nishi
Yasuhiko Murayama