Title:
半導体ウェーハのダイシング用フレーム
Document Type and Number:
Japanese Patent JP4693545
Kind Code:
B2
Inventors:
Noriyoshi Hosono
Satoshi Odashima
Kiyofumi Tanaka
Satoshi Odashima
Kiyofumi Tanaka
Application Number:
JP2005235860A
Publication Date:
June 01, 2011
Filing Date:
August 16, 2005
Export Citation:
Assignee:
Shin-Etsu Polymer Co., Ltd.
International Classes:
H01L21/301; H01L21/683
Domestic Patent References:
| JP60063943U | ||||
| JP2001007056A | ||||
| JP8213349A |
Attorney, Agent or Firm:
Eisuke Fujimoto
Masayoshi Kanda
Akio Miyao
Masayoshi Kanda
Akio Miyao