Title:
半導体基板、半導体素子、及び半導体発光素子
Document Type and Number:
Japanese Patent JP4693547
Kind Code:
B2
Inventors:
Koichi Tachibana
Chie Hongo
Shinya Nunogami
Masaaki Onomura
Chie Hongo
Shinya Nunogami
Masaaki Onomura
Application Number:
JP2005243330A
Publication Date:
June 01, 2011
Filing Date:
August 24, 2005
Export Citation:
Assignee:
Toshiba Corporation
International Classes:
H01L29/201; H01L21/205; H01L21/331; H01L21/338; H01L29/04; H01L29/737; H01L29/778; H01L29/812; H01L33/16; H01L33/32; H01S5/323
Domestic Patent References:
| JP2006066869A | ||||
| JP2000223743A |
Attorney, Agent or Firm:
Hidekazu Miyoshi
Iwa Saki Kokuni
Kawamata Sumio
Nakamura Tomoyuki
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu
Iwa Saki Kokuni
Kawamata Sumio
Nakamura Tomoyuki
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu