Title:
電子回路基板の配線パターン補修方法及び配線パターン補修装置
Document Type and Number:
Japanese Patent JP4701036
Kind Code:
B2
Inventors:
Mizumura Tsushin
Takafumi Hirano
Takafumi Hirano
Application Number:
JP2005230709A
Publication Date:
June 15, 2011
Filing Date:
August 09, 2005
Export Citation:
Assignee:
Buoy Technology Co., Ltd.
International Classes:
H05K3/22
Domestic Patent References:
| JP6350226A | ||||
| JP4142037A | ||||
| JP2005166750A | ||||
| JP11158686A | ||||
| JP1255684A | ||||
| JP2115389A | ||||
| JP1198496A | ||||
| JP5175390A | ||||
| JP2004134596A | ||||
| JP200049442A |
Attorney, Agent or Firm:
Shuji Hamada