Title:
電子回路モジュールの放熱構造
Document Type and Number:
Japanese Patent JP4764497
Kind Code:
B2
Inventors:
Zhao Haiyan
Yuya Kudo
Fujiwara Mikine
Yuya Kudo
Fujiwara Mikine
Application Number:
JP2009176737A
Publication Date:
September 07, 2011
Filing Date:
July 29, 2009
Export Citation:
Assignee:
Toshiba Corporation
International Classes:
H05K7/20
Domestic Patent References:
| JP2001345562A | ||||
| JP62015774A | ||||
| JP2004008272A | ||||
| JP2961858B2 | ||||
| JP2001127475A | ||||
| JP5335765A |
Attorney, Agent or Firm:
Patent Business Corporation Sakura International Patent Office
Hiroshi Horiguchi
Hiroshi Horiguchi