Title:
ランプのリードワイヤとアイレットとの接続方法
Document Type and Number:
Japanese Patent JP4767469
Kind Code:
B2
Abstract:
The invention relates to a method for connecting a contact plate (2) a lamp cap to the supply conductor wire (4) which is passed through an aperture (2a) in the contact plate (2). With the aid of a wire (5) which serves as filler, the supply conductor wire (4) and the contact plate (2) are soldered together, by generating an arc between the additional wire (5) and the supply conductor wire (4) or the contact plate (2). The solidified molten material of the additional wire (5) closes off the aperture (2a) and produces a reliable soldered join between the supply conductor wire (4) and the contact plate (2). The polarity of the electric voltage used to generate the arc is advantageously such that the additional wire (5) acts as an anode and the contact plate (2) or the supply conductor wire (4) acts as a cathode. The soldering process according to the invention advantageously takes place under an inert-gas atmosphere.
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Inventors:
Becker, Wolf-Ludger
Fornalski, Martin
Fornalski, Martin
Application Number:
JP2001555118A
Publication Date:
September 07, 2011
Filing Date:
January 22, 2001
Export Citation:
Assignee:
PATENT-TREUHAND-GESELLSCHAFT FUR ELEKTRISCHE GLUHLAMPEN MIT BESCHRANKTER HAFTUNG
International Classes:
H01J9/36; H01J5/46; H01K3/16; H01J9/24; H01J61/36; H01K1/40; H01K1/46
Domestic Patent References:
| JPH08138631A | 1996-05-31 | |||
| JPH10275602A | 1998-10-13 | |||
| JPH06275244A | 1994-09-30 | |||
| JPS6273552A | 1987-04-04 | |||
| JP2000340114A | 2000-12-08 | |||
| JP2000331650A | 2000-11-30 |
Attorney, Agent or Firm:
Iwao Yamaguchi