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Title:
表面実装機および表面実装機用の保護カバー
Document Type and Number:
Japanese Patent JP4772074
Kind Code:
B2
More Like This:
WO/2018/203373MOUNTING DEVICE, INFORMATION PROCESSING DEVICE, MOUNTING SYSTEM, MOUNTING METHOD, AND INFORMATION PROCESSING METHOD
JPH0810239[Name of invention] Electronic component positioning device
Inventors:
Kazuyuki Shiozawa
Manabu Ihara
Application Number:
JP2008078204A
Publication Date:
September 14, 2011
Filing Date:
March 25, 2008
Export Citation:
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Assignee:
YAMAHA HATSUDOKI KABUSHIKI KAISHA
International Classes:
H05K13/04; H05K13/02
Domestic Patent References:
JP2007329443A
JP2002111297A
JP2000165088A
JP2007214461A
Attorney, Agent or Firm:
Akatsuki Joint Patent Office



 
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