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Patent Searching and Data


Title:
樹脂成形体及びその成形方法
Document Type and Number:
Japanese Patent JP4773191
Kind Code:
B2
Abstract:

To prevent occurrence of a crack in the boundary of an expanded panel with a solid panel part in a resin molded product molded by expansion molding.

At the time of expansion molding, a cavity volume is magnified in a state in which a thermoplastic resin is much charged in the cavity place corresponding to the boundary of the expansion panel part 3 with the solid panel part 9 in a direction more magnifying the cavity volume than its periphery to mold a panel-shaped carrier plate 1 by the expansion panel part 3 and the solid panel part 9. The panel thickness T1 of the expansion panel part 3 is formed so as to be made larger than the panel thickness T2 of the solid panel part 9 and an erected wall 21 comprising a solid layer 20 erected in the panel thickness direction is formed to the boundary of the expansion panel part 3 and the solid panel part 9. The protruded part 23 comprising the solid layer is integrally formed to the leading end in the panel thickness direction of the erected wall 21 so as to be more largely protruded than the panel surface 3a of the expansion panel part 3.

COPYRIGHT: (C)2007,JPO&INPIT


Inventors:
Toshiki Miyaji
Application Number:
JP2005357246A
Publication Date:
September 14, 2011
Filing Date:
December 12, 2005
Export Citation:
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Assignee:
DaikyoNishikawa Co., Ltd.
International Classes:
B29C45/56; B29C45/33; B29L31/30
Domestic Patent References:
JP2007030441A
JP10180825A
JP2003266469A
JP2002036318A
JP2002067111A
JP2003326550A
JP2004330789A
JP9174614A
Attorney, Agent or Firm:
Hiroshi Maeda
Hiroshi Takeuchi
Takahisa Shimada
Yuji Takeuchi
Katsumi Imae
Atsushi Fujita
Kazunari Ninomiya
Tomoo Harada
Iseki Katsumori
Seki Kei
Yasuya Sugiura