Title:
半導体装置の製造方法
Document Type and Number:
Japanese Patent JP4774665
Kind Code:
B2
Inventors:
Yosuke Murakami
Application Number:
JP2003028613A
Publication Date:
September 14, 2011
Filing Date:
February 05, 2003
Export Citation:
Assignee:
ソニー株式会社
International Classes:
B82B1/00; H01L29/06; B82B3/00; H01L21/302; H01L21/8238; H01L27/08; H01L27/092; H01L29/786
Domestic Patent References:
| JP2002118248A | ||||
| JP2002097009A | ||||
| JP2002255520A | ||||
| JP2002299705A | ||||
| JP5315287A | ||||
| JP4131377A | ||||
| JP60063934A | ||||
| JP2000141056A |
Attorney, Agent or Firm:
Koichi Mori
Masaaki Yoshii
Takahisa Yamamoto
Masaaki Yoshii
Takahisa Yamamoto